Minangka wafer keramik Alumina polishing lan sapir lapping disk digunakake ing semi-konduktif, polishing mirah etc.
Proses: Kabeh jinis proses Polishing lan lapping, kayata polishing mekanik kimia CMP, Polishing Mekanik, Polishing Precision.
Kemurnian dhuwur lan daya tahan kimia
Kekuwatan Mekanik Dhuwur lan Kekerasan
Resistance Korosi Dhuwur
Resistance High Voltage
Tahan Suhu Dhuwur Nganti 1700ºC
Kinerja Resistance Abrasi Banget
Kinerja Insulasi sing Apik banget
Kabeh jinis Ukuran 180,360, 450, 600mm etc
jeneng produk | 99.7 kemurnian dhuwur Alumina keramik Polishing Lapping Discs |
Bahan | 99,7% alumina |
Ukuran Normal | D180, 360, 450, 600mm, ukuran disesuaikan ditampa. |
warna | gadhing |
Aplikasi | Proses CMP Wafer lan Sapphire ing industri semi-konduktif |
Min.Pesanan | 1 Gambar |
Unit | 99.7 Keramik Alumina | ||
Properti Umum | kandungan Al2O3 | wt% | 99.7-99.9 |
Kapadhetan | gm/cc | 3.94-3.97 | |
warna | - | gadhing | |
panyerepan banyu | % | 0 | |
Sifat Mekanik | Kekuwatan lentur (MOR) 20 ºC | Mpa(psix10^3) | 440-550 |
Modulus elastis 20ºC | GPa (psix10^6) | 375 | |
Kekerasan Vickers | Gpa(kg/mm2) R45N | >=17 | |
Kekuwatan Mlengkung | Gpa | 390 | |
Kekuwatan Tarik 25ºC | MPa(psix10^3) | 248 | |
Ketangguhan Patah (KI c) | Mpa* m^1/2 | 4-5 | |
Sifat termal | Konduktivitas termal (20ºC) | W/mk | 30 |
Koefisien ekspansi termal (25-1000ºC) | 1x 10^-6/ºC | 7.6 | |
Thermal Shock Resistance | ºC | 200 | |
Suhu panggunaan maksimal | ºC | 1700 | |
Properti Listrik | Kekuwatan Dielektrik (1MHz) | ac-kv/mm(ac v/mil) | 8.7 |
Konstanta dielektrik (1 MHz) | 25ºC | 9.7 | |
Resistivitas Volume | ohm-cm (25ºC) | >10^14 | |
ohm-cm (500ºC) | 2×10^12 | ||
ohm-cm (1000ºC) | 2×10^7 |
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